The company has announced that its wholly-owned subsidiary, Guangdong Longguang New Material Technology Co., Ltd., has officially commenced operations in the new business segment of TGV glass-based copper clad laminate materials.

With the surge in demand for AI chips and advanced semiconductor packaging, TGV glass substrates are emerging as a high-growth industry segment due to their advantages of low dielectric loss, low expansion, and high stability.

The group's existing production capacity for coated conductive glass, ultra-thin specialty glass deep-processing products, and flame-retardant composite panels provides an upstream raw material advantage, establishing a foundation for vertically integrated research and production.

Products from this project will cover AI computing power packaging substrates and electronic base materials for automotive-grade energy storage.

The industrial chain is scheduled to be established in Shenzhen in the first half of 2026, with a pilot production line expected to be operational in the second half of the year. Subsequent capacity expansions will be implemented in phases based on customer certification progress.

Funding for this project will be supported by the operational cash flow from the group's new materials division, with the possibility of appropriate financing for expansion as needed.

The board of directors believes the new business will enhance the group's advanced new materials industrial chain, create a second growth engine, and simultaneously increase the group's revenue.

The company will continue to monitor the progress of this project and make timely disclosures.