On September 4, Micron Technology rose 3.53% in regular trading, reaching $995.75/share with turnover of $4.994 billion, as the company's aggressive HBM production expansion plan fueled bullish sentiment across the memory chip sector.

On the news front, Micron plans to nearly double its High Bandwidth Memory (HBM) monthly wafer production capacity to approximately 100,000 wafers by year-end, up from roughly 40,000–50,000 wafers last year, adding up to 60,000 wafers of new monthly capacity. The expansion aims to narrow the gap with SK hynix and Samsung Electronics, which each maintain estimated HBM capacity of 150,000–200,000 wafers per month. As of Q2, global HBM market share stood at SK hynix 50%, Samsung 32%, and Micron 18%.

Micron is accelerating mass production of HBM4 12-layer products targeting NVIDIA's Vera Rubin AI accelerator architecture, with HBM4 output share expected to rise to 50% by year-end from approximately 20%–30% earlier this year. CEO Mehrotra previously noted that HBM4 production ramp speed is roughly twice that of HBM3E, with cumulative HBM4 revenue already surpassing $1 billion. The broader storage sector rallied in tandem, with SK hynix up 3.62%.

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