深科技：子公司擬投資18.5億元擴大高端存儲芯片封測產能

智通財經

09/09

【深科技：子公司擬投資18.5億元擴大高端存儲芯片封測產能】深科技公告稱，公司全資子公司沛頓科技擬進一步實施高端存儲芯片封測產能擴充項目。項目計劃總投資18.5億元，一是擬投資12.2億元新設全資子公司建設新廠房，經測算可承載傳統封測9萬片/月及2.5D先進封裝1萬片/月產能；二是擬投資6.3億元建設2.5D/3DS先進封裝研發線，建成達產後預計增加2.5D/3DS先進封裝產能各100片/月。項目計劃2028年12月建成。

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