聯發科搶先高通(QCOM.US)發布首款2nm手機芯片天璣9600 Pro，端側AI性能大增

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2小時前

【聯發科搶先高通(QCOM.US)發布首款2nm手機芯片天璣9600 Pro，端側AI性能大增】智通財經APP獲悉，聯發科(MediaTek)周二發布了一款採用台積電(TSM.US)最先進製造工藝打造的新智能手機芯片，目標直指高端手機市場——其半導體產品能夠讓更多 AI 功能直接在設備端運行。此舉是聯發科向美國競爭對手高通(QCOM.US)爭奪高端手機市場的整體戰略的一部分。在這個市場，價格更高的設備與 AI 功能能為芯片廠商帶來更好的利潤率。

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