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晶合集成

28.000

-0.520-1.82%

成交量：90.99萬

成交額：2,548.09萬

市值：625.80億

市盈率：69.89

高：28.500

開：27.520

低：27.340

收：28.520

52周最高：37.000

52周最低：26.700

股本：22.35億

香港流通股本：2.27億

量比：0.58

換手率：0.40%

股息：- -

股息率：- -

每股收益(LYR):0.401

淨資產收益率：1.59%

總資產收益率：0.76%

市淨率：2.30

市盈率(LYR):69.89

市銷率: 4.59

資料載入中...

總覽公司新聞公告

A股MCU概念板塊異動拉升

科創50日內漲幅達1.00%，成分股中，傳音控股漲7.91%，國博電子漲7.17%，晶合集成漲6.67%，源傑科技漲5.

科創50探底回升翻紅

新股招股 | 晶合集成今起招股，一手入場費3262.57港元

老虎资讯综合

晶合集成(02249)6月30日至7月7日招股擬全球發售2.16億股H股引入集創、璞新科技等基石投資者

晶合集成(688249.SH)：H股發行價格最高不超過每股32.30港元

新股快訊：合肥晶合集成電路（02249）啓動全球發售，最高發售價每股32.30港元

晶合集成獲得實用新型專利授權：「一種半導體薄膜沉積設備」

770億合肥芯片「黑馬」晶合集成衝刺港股IPO：增收不增利，淨利潤大幅下滑62.61%、淨利率不足1%

又一半導體巨頭要登陸港交所了

华尔街见闻

晶合集成通過聆訊：第一季營收29億淨利按年降63% 華勤技術持股11%

新股消息 | 晶合集成(688249.SH)通過港交所聆訊 2025年12英寸晶圓的平均月產量為139千片

晶合集成赴港IPO，專注於12英寸晶圓代工，全球第九！

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2026年6月30日至2026年7月7日招股，该公司拟全球发售2.16亿股H股，其中，香港公开发售占约10%，国际发售占约90%，另有15%超额配股权。每股发售价30-32.3港元。预期所得款项净额约23.1%将用于基于AI技术的智能研发及生产。于2023年、2024年及2025年，净利润分别为人民币1.19亿元、人民币4.82亿元及人民币4.67亿元，同年净利润率分别为1.7%、5.3%及4.5%。","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1460877.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["IPOS","02249","688249","BK0214"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2647588799","title":"晶合集成(688249.SH)：H股發行價格最高不超過每股32.30港元","url":"https://stock-news.laohu8.com/highlight/detail?id=2647588799","media":"智通财经","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2647588799?lang=zh_tw&edition=fundamental","pubTime":"2026-06-30 08:10","pubTimestamp":1782778235,"startTime":"0","endTime":"0","summary":"智通财经APP讯，晶合集成 发布公告，公司本次全球发售H股基础发行股数为2.16亿股，其中，初步安排香港公开发售2161.67万股，约占全球发售总数的10%;国际发售1.95亿股，约占全球发售总数的90%。在超额配售权悉数行使的情况下，公司本次全球发售H股的最大发行股数为2.49亿股。公司本次H股发行的价格最高不超过每股32.30港元。公司本次发行的H股预计于2026年7月10日在香港联交所挂牌并开始上市交易。","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1460863.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["BK0214","EWH","02249","688249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1149704431","title":"新股快訊：合肥晶合集成電路（02249）啓動全球發售，最高發售價每股32.30港元","url":"https://stock-news.laohu8.com/highlight/detail?id=1149704431","media":"公告速递","labels":["shareholding","SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1149704431?lang=zh_tw&edition=fundamental","pubTime":"2026-06-30 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2025年12英寸晶圓的平均月產量為139千片","url":"https://stock-news.laohu8.com/highlight/detail?id=2641486376","media":"智通财经","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2641486376?lang=zh_tw&edition=fundamental","pubTime":"2026-06-08 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