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晶合集成

28.000

-0.520-1.82%

成交量：90.99萬

成交額：2,548.09萬

市值：625.80億

市盈率：69.89

高：28.500

開：27.520

低：27.340

收：28.520

52周最高：37.000

52周最低：26.700

股本：22.35億

香港流通股本：2.27億

量比：0.58

換手率：0.40%

股息：- -

股息率：- -

每股收益(LYR):0.401

淨資產收益率：1.59%

總資產收益率：0.76%

市淨率：2.30

市盈率(LYR):69.89

市銷率: 4.60

資料載入中...

總覽公司新聞公告

晶合集成：後續代工報價會綜合市場需求等因素綜合考慮

晶合集成(02249)股價上升5.065%，現價港幣$29.04

阿斯达克财经

晶合集成盤中漲近4% 近日擬以合肥瑞昱科技全部股權向安徽瑞晶半導體增資

港股異動 | 晶合集成(02249.HK)漲近4% 近日擬以合肥瑞昱科技全部股權向安徽瑞晶半導體增資

TrendForce：二季度全球前十大晶圓代工廠合計產值接近534.9億美元再創新高

晶合集成(02249.HK)披露2026年上半年持續督導報告：營收59.57億元增14.59%，淨利降26.12%

晶合集成更新2026年8月股份變動月報，H股新增發行10,886,900股

晶合集成（02249）將於9月10日參加科創板半年度半導體行業業績説明會

摩根士丹利在晶合集成的H股好倉比例上升0.51%至7.15%

南方财经网

晶合集成(02249.HK)擬以持有的合肥瑞昱科技100%股權向安徽瑞晶半導體增資

晶合集成2.41億元資產注入安徽瑞晶半導體持股約26.43%

晶合集成2026年半年報：淨利潤下滑26%，顯示驅動芯片佔比收縮拖累盈利

晶合集成2026年上半年營收57.66億元，經調整淨利潤3.27億元

晶合集成（02249）完成H股上市後註冊資本升至22.35億元多項議案獲董事會通過

晶合集成（02249）聘任方華為副總經理任期至第二屆董事會屆滿

晶合集成（02249）2023年股權激勵預留部分首期確認歸屬14.16萬股，同步註銷89.38萬股

晶合集成(02249)披露2026年上半年募資使用情況：累計投入約90.14億元，專户餘額清零

晶合集成（02249）發布2026年中期業績：營收57.66億元按年增12.40%

晶合集成（02249）完成超額配股後修訂章程註冊資本增至22.35億元

晶合集成（02249）董事會擬迎來人事調整楊國慶與盛明泉獲提名

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15:33","pubTimestamp":1788939227,"startTime":"0","endTime":"0","summary":"智通财经APP获悉，根据TrendForce集邦咨询最新研究，2026年第二季全球前十大晶圆代工厂合计产值季增11.5%，已接近534.9亿美元，再创新高。分析第二季前十大晶圆代工厂商营收表现，TSMC营收近402亿美元，季增12.1%，以72.5%的市占率稳居龙头。第五名GlobalFoundries(格芯)因消费性客户陆续恢复备货动能，加上AI/Server周边Power、TIA/Driver等产品需求成长，第二季晶圆出货与ASP同步增长，营收季增9.3%至17.9亿美元左右，市占为3.2%。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1493821.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["LU1267930490.SGD","LU1803068979.SGD","MEMX","TSMY","LU1282649067.USD","BK4612","LU2237443549.SGD","ASIA","688249","IE0004086264.USD","LU2111349929.HKD","TSMX","SG9999000418.SGD","LU2357125470.USD","SG9999004220.SGD","LU0878005551.USD","LU0889565833.HKD","CORO","688981","LU1934455277.USD","LU0143863198.USD","LU2023250504.SGD","LU2054465674.USD","LU0211327993.USD","LU0143863784.USD","LU2023251221.USD","LU2360108059.USD","LU2491050071.SGD","LU1037948897.HKD","SGXZ99366536.SGD","LU0345770993.USD","LU0965508806.USD","CWI","IE00BQXX3F31.USD","LU0719512351.SGD","LU1989764748.USD","LU2471134879.HKD","LU1267930813.SGD","IE00BYQQ9H92.USD","LU2133065610.SGD","LU2491049909.HKD","TSEU","LU0323591593.USD","LU0823421416.USD","LU1974910355.USD","CHPX","IE00B3M56506.USD","LU0878004406.USD","CNEQ","LU2543165471.USD","SGXZ81514606.USD","LU0289960550.SGD","LU2211814178.USD","LU0823414478.USD","LU0965509010.AUD","BK4533","LU2089283258.USD","IE00BQXX3D17.EUR","LU0264606111.USD","LU0359201612.USD","LU1048588211.SGD","LU1989764664.SGD","LU0823414551.USD","LU2458330243.SGD","BK4141","LU1712237335.SGD","FDTX","LU1934455194.USD","LU2125154778.USD","LU0175139822.USD","LU2471134952.CNY","TEK","TTEQ","BK4588","LU0384037296.USD","LU2028103732.USD","ESIM","LU2237443622.USD","BK4585","KNOW","LU0198837287.USD","LU1989772840.SGD","LU2294711713.HKD","TSM","IE00BKPKM429.USD","LU0792757196.USD","UMMA","LU0882747503.HKD","02249","LU0348723411.USD","LU2237443382.USD","LU2125154935.USD","LU0158827948.USD","LU2360107168.USD","LU0359202008.SGD","LU2290526834.HKD","LU1064130708.USD","LU2471134796.USD","LU2298321311.HKD","TSMG","LU0109392836.USD","BK4534","LU1282649810.SGD","TSEM","IE0009354923.USD","LU1917777945.USD","LU0353189763.USD","SPTE","BK0214","SMH","LU2471134523.USD","SGXZ49509284.SGD","LU1037948541.HKD","CGIC","IE00BHPRN162.USD","BK4526","LU0158827781.USD","LU1861220033.SGD","LU1934455863.HKD","LU2087625088.SGD","TINS","TSMZ","BK4602","LU0965509101.SGD","LU1868838027.USD","LU0572940350.SGD","LU0965509283.SGD","LU1211504680.USD","BK4581","LU0572939691.SGD","LU2249611893.SGD","LU1861215975.USD","LU0353189680.USD","LU0310799852.SGD","GFS","LU1064131003.USD","LU0541501648.USD","BK4527","SPWO","LU2750360997.AUD","LU0082616367.USD","LU2098885051.SGD","CGGO","LU1868837565.USD","LU2491050154.USD","LU0689626769.HKD","LU2360106780.USD","LU2237443978.SGD","LU1989772923.USD","LAZR","LU0238689110.USD","LU1323610961.USD","ADVE","LU2506951792.HKD","TWSC","LU0094547139.USD","IE00B5TLWC47.USD","LU2360032135.SGD","AVSE","LU2458330169.SGD","LU0642271901.SGD","LU2860962120.EUR","LU0889566641.SGD","IE00BQXX3C00.GBP","LU0861579265.USD","BK4591","BK4532","LU1868837722.USD","BK4503","LU0359201885.HKD","IE0004445239.USD","LU1316542783.SGD","AVEM","IE0004091025.USD","LU2106854487.HKD","LU1623119135.USD","BLOX","LU2211815571.USD","BK4543","LU0345770308.USD","STSM","BK4554","LU1508157978.USD","LU2148510915.USD","LU0823421333.USD","LU0211328371.USD","LU1852331112.SGD","IE00BD6J9T35.USD","LU2750360641.GBP","LU2247934214.USD","LU2250418816.HKD","WUGI","CGNG","CGDG","LU1023057109.AUD","TSEG","LU2092937221.SGD","03145","LU0124676726.USD","LU2089284900.SGD","LU2663582299.SGD","LU2063271972.USD","LUMA","BK4605","LU0056508442.USD","BK4505","IE00BZ199S13.USD","TSMU","AIQ","LU0541502299.USD","LU2271345857.HKD","LU0072462343.USD","LU0316494557.USD","GFSG","LU0488056044.USD","00981","EMM","IE00BFXG0V08.USD","BAI","BK4512","EMC","BK4550","LU1303367103.USD","LU2041044095.USD","SGXZ51526630.SGD","SGXZ81163826.USD","BK4548","AVXC"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1118735751","title":"晶合集成(02249.HK)披露2026年上半年持續督導報告：營收59.57億元增14.59%，淨利降26.12%","url":"https://stock-news.laohu8.com/highlight/detail?id=1118735751","media":"公告速递","labels":["SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1118735751?lang=zh_tw&edition=fundamental","pubTime":"2026-09-04 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19:11","pubTimestamp":1788174697,"startTime":"0","endTime":"0","summary":"2026年8月31日，晶合集成公告称，公司已与安徽瑞晶半导体有限公司、现有股东及其他增资方签署《增资及股东协议》，拟通过股权出资及现金方式共同向目标公司增资4.11亿元。根据协议，晶合集成将以合肥瑞昱科技100%股权作价2.41亿元出资，认购目标公司等额新增注册资本；其他增资方合计以现金1.70亿元认购目标公司新增注册资本。增资完成后，目标公司注册资本将由5.01亿元增至9.11亿元，晶合集成将直接持有目标公司约26.43%股权。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation,SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2663014243","title":"晶合集成2026年半年報：淨利潤下滑26%，顯示驅動芯片佔比收縮拖累盈利","url":"https://stock-news.laohu8.com/highlight/detail?id=2663014243","media":"蓝鲸财经","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2663014243?lang=zh_tw&edition=fundamental","pubTime":"2026-08-29 15:29","pubTimestamp":1787988573,"startTime":"0","endTime":"0","summary":"报告期内，公司实现营业收入57.66亿元人民币，同比增长12.40%；归属于上市公司股东的净利润为2.45亿元人民币，同比下降26.12%。截至2026年6月30日，公司资产总额达587.83亿元人民币，负债总额为276.56亿元人民币，基本每股收益为0.13元人民币。管理层指出，报告期内研发开支为7.59亿元人民币，占收入比重13.17%，其中符合资本化条件的项目进入开发阶段致使费用化研发投入同比下降12.32%。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":["earning"],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.lanjinger.com/d/1787986428261697240","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"lanjinger_stock","symbols":["BK1163","02249","688249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1101414488","title":"晶合集成2026年上半年營收57.66億元，經調整淨利潤3.27億元","url":"https://stock-news.laohu8.com/highlight/detail?id=1101414488","media":"公告速递","labels":["SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1101414488?lang=zh_tw&edition=fundamental","pubTime":"2026-08-28 17:48","pubTimestamp":1787910520,"startTime":"0","endTime":"0","summary":"晶合集成公布2026年上半年业绩，营收为57.66亿元，同比增长12.40%。经调整净利润为3.27亿元，同比下降3.25%。经营利润约5.67亿元，经营利润率为9.83%，较上年同期提高2.30个百分点。期内经营活动现金流净额为27.98亿元，同比增长64.10%。上半年销售和管理费用总体增至3.04亿元。公司预期2026年第三季度营收规模约为32.00亿元至33.00亿元，并预计届时毛利率在25%至27%范围。","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":"晶合集成2026年上半年营收57.66亿元，经调整净利润3.27亿元","news_tag":"SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1194735835","title":"晶合集成（02249）完成H股上市後註冊資本升至22.35億元 多項議案獲董事會通過","url":"https://stock-news.laohu8.com/highlight/detail?id=1194735835","media":"公告速递","labels":["SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1194735835?lang=zh_tw&edition=fundamental","pubTime":"2026-08-24 21:56","pubTimestamp":1787579796,"startTime":"0","endTime":"0","summary":"2026年8月25日，合肥晶合集成电路股份有限公司公告披露，第二届董事会第三十七次会议于2026年8月24日召开，全部9名董事出席并审议通过11项议案，核心内容如下：。– 公司完成H股发行上市后，总股本由2,007,591,697股增至2,234,645,597股。– 注册资本同步由人民币2,007,591,697元调整为人民币2,234,645,597元，折合约22.35亿元。– 公司将按程序向市场监督管理部门办理注册资本及《公司章程》变更、备案手续。上述全部议案均以9票赞成、0票反对、0票弃权获得通过。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1111960588","title":"晶合集成（02249）聘任方華為副總經理  任期至第二屆董事會屆滿","url":"https://stock-news.laohu8.com/highlight/detail?id=1111960588","media":"公告速递","labels":["executive","SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1111960588?lang=zh_tw&edition=fundamental","pubTime":"2026-08-24 21:56","pubTimestamp":1787579781,"startTime":"0","endTime":"0","summary":"合肥晶合集成电路股份有限公司8月25日公告称，公司已于2026年8月24日召开第二届董事会第三十七次会议，通过《关于聘任公司高级管理人员的议案》，决定聘任方华为公司副总经理。方华自议案审议通过之日起正式就任，其任期至公司第二届董事会任期届满时止。截至公告披露日，方华未直接持有公司股份，与公司实际控制人、其他董事及持股5%以上股东不存在关联关系；未受到中国证监会及证券交易所的处罚，也不属于失信被执行人。","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"executive,SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1174113572","title":"晶合集成（02249）2023年股權激勵預留部分首期確認歸屬14.16萬股，同步註銷89.38萬股","url":"https://stock-news.laohu8.com/highlight/detail?id=1174113572","media":"公告速递","labels":["SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1174113572?lang=zh_tw&edition=fundamental","pubTime":"2026-08-24 21:46","pubTimestamp":1787579173,"startTime":"0","endTime":"0","summary":"2026年8月24日，晶合集成电路股份有限公司董事会召开第二届董事会第三十七次会议，审议通过两项与2023年限制性股票激励计划相关的核心议案：。归属价格与授予信息：上述股份的授予日为2024年5月31日，授予价格经2024年度权益分派调整后为每股9.97元。余额情况：本次注销后，2023年限制性股票激励计划剩余已授予但尚未归属的限制性股票为11,261,848股。","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1188646022","title":"晶合集成(02249)披露2026年上半年募資使用情況：累計投入約90.14億元，專户餘額清零","url":"https://stock-news.laohu8.com/highlight/detail?id=1188646022","media":"公告速递","labels":["SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1188646022?lang=zh_tw&edition=fundamental","pubTime":"2026-08-24 21:46","pubTimestamp":1787579171,"startTime":"0","endTime":"0","summary":"2026年8月25日，合肥晶合集成电路股份有限公司公布《2026年半年度募集资金存放、管理与实际使用情况的专项报告》，披露公司截至2026年6月30日的募资管理与使用进展。报告显示，2026年上半年公司新增募集资金使用金额为336.80万元，累计使用金额达到90.14亿元，募集资金使用及信息披露不存在违规情形。","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1129941419","title":"晶合集成（02249）發布2026年中期業績：營收57.66億元按年增12.40%","url":"https://stock-news.laohu8.com/highlight/detail?id=1129941419","media":"公告速递","labels":["SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1129941419?lang=zh_tw&edition=fundamental","pubTime":"2026-08-24 20:23","pubTimestamp":1787574209,"startTime":"0","endTime":"0","summary":"2026年8月24日，晶合集成公布截至2026年6月30日止六个月未经审计的中期业绩。公司期内实现收入57.66亿元，同比增长12.40%；毛利12.33亿元，同比下降2.14%；毛利率为21.38%。除所得税前利润2.36亿元，同比增长1.53%；期内利润2.22亿元，同比下降4.52%。其中，本公司拥有人应占利润2.45亿元，同比下降26.12%；基本每股收益0.13元，上年同期为0.17元。经营活动产生的现金流量净额27.98亿元，同比增长64.10%。公司预计2026年第三季度收入约32亿元至33亿元，毛利率约25%至27%。","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1157278119","title":"晶合集成（02249）完成超額配股後修訂章程 註冊資本增至22.35億元","url":"https://stock-news.laohu8.com/highlight/detail?id=1157278119","media":"公告速递","labels":["shareholding","SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1157278119?lang=zh_tw&edition=fundamental","pubTime":"2026-08-24 20:22","pubTimestamp":1787574179,"startTime":"0","endTime":"0","summary":"2026年8月24日，晶合集成公告称，公司已针对全球发售及部分行使超额配股权后的资本变动，对《公司章程》相关条款进行修订。公司于2026年7月10日发行216,167,000股H股；2026年8月6日，承销商部分行使超额配股权，额外发行10,886,900股H股。加上原有A股2,007,591,697股，公司总股本增至2,234,645,597股，每股面值人民币1.00元。与H股发行及注册资本变更相关的条款自2026年8月24日起生效，其余条款仍待股东大会审议通过。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"shareholding,SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1105273273","title":"晶合集成（02249）董事會擬迎來人事調整 楊國慶與盛明泉獲提名","url":"https://stock-news.laohu8.com/highlight/detail?id=1105273273","media":"公告速递","labels":["executive","SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1105273273?lang=zh_tw&edition=fundamental","pubTime":"2026-08-24 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