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VanEck China Semiconductor ETF

44.75

+0.70761.61%

盤後：44.750.00000.00%16:10 EDT

成交量：1.41萬

成交額：63.27萬

市值：2,013.75萬

市盈率：- -

高：44.95

開：44.95

低：44.72

收：44.04

52周最高：68.69

52周最低：42.79

股本：45.00萬

流通股本：45.00萬

量比：0.51

換手率：3.14%

股息：- -

股息率：- -

淨資產收益率：--

總資產收益率：--

市淨率：--

市盈率(LYR):- -

資料載入中...

總覽公司新聞資訊公告

快訊：科創50指數升逾1% 半導體設備板塊震盪反彈

多隻科創半導體ETF升逾3%

半導體設備板塊持續拉升，華海清科升逾10%

半導體設備板塊震盪反彈臻寶科技升逾10%

兩部門：提升人工智能芯片設計水平

兩部門：提升人工智能芯片設計水平

兩部門：提升人工智能芯片設計水平

韓媒：中國半導體由政府銀行企業以一團隊體制推進

一個織布廠長，押對中國半導體30年

ETF資金流|資金淨流出創新藥ETF、港股通創新藥ETF、化工ETF、半導體設備ETF等

興福電子：大基金二期減持計劃屆滿減持1%股份

據兩名知情人士透露，美國司法部正在調查英偉達(NVDA.US)是否試圖規避反壟斷審查，以達成去年與人工智能芯片製造商Gr

13個漲停！存儲擴產攪動半導體設備，有公司淨利增1324%

機構：2026年第二季晶圓代工營收接近534.9億美元先進製程與AI需求持續強勁

機構：2Q26晶圓代工營收接近534.9億美元，先進製程與AI需求持續強勁

機構：2Q26晶圓代工營收接近534.9億美元，先進製程與AI需求持續強勁

【券商聚焦】中信建投：看好半導體設備下半年創新高

業內人士：成熟製程芯片供需緊張或持續至 2028 年

中信建投：存儲IPO繼續推動，看好半導體設備下半年創新高

英特爾晶圓代工與阿斯麥深化合作，推動High-NA EUV用於更大尺寸AI芯片

TradingKey中文

{"basename":"/hant","ssrTDKData":{"titleTemplate":"%s - 老虎證券","title":"老虎證券香港 | 輕鬆買賣美股港股A股/美債/ETF/Crypto/期權期貨","description":"老虎證券香港提供多種優惠: 港股&Crypto 0佣、A股一年0佣、美股期權0佣、IPO抽新股0孖展利息0手續費。美股1美金起投，即時串流報價與多種工具，立即開戶享更多優惠！","keywords":"老虎證券,老虎證券開戶,老虎證券香港,老虎證券投資,老虎證券美股,老虎證券登錄,證券開戶,證券公司開戶,股票開戶,香港證券公司,香港證券,證券公司,美股投資平台,小額投資理財,投資app,投資平台,股票買賣,買賣股票平台,炒股app,證券app,新手投資","social":{"ogDescription":"老虎證券香港提供多種優惠: 港股&Crypto 0佣、A股一年0佣、美股期權0佣、IPO抽新股0孖展利息0手續費。美股1美金起投，即時串流報價與多種工具，立即開戶享更多優惠！","ogImage":"https://c1.itigergrowtha.com/portal5/static/media/og-logo.0a0bd8dc.png","ogUrl":"https://www.atigrcrest.com/hant/stock/SMHC/news"},"companyName":"老虎證券"},"pageData":{"isMobile":false,"isTiger":false,"isTTM":true,"region":"HKG","license":"TBHK","edition":"fundamental","symbol":"SMHC","isAnalysisPage":false},"__swrFallback__":{"@#url:\"https://hq.skytigris.cn/stock_info/detail/global\",params:#delay:false,,method:\"POST\",data:#items:@#symbol:\"SMHC\",,,,,undefined,":{"symbol":"SMHC","market":"US","secType":"STK","nameCN":"VanEck China Semiconductor ETF","latestPrice":44.75,"timestamp":1789502400000,"preClose":44.0424,"halted":0,"volume":14119,"hourTrading":{"tag":"盘后","latestPrice":44.75,"preClose":44.75,"latestTime":"16:10 EDT","volume":106,"amount":4743.5,"timestamp":1789503007565,"change":0,"changeRate":0,"amplitude":0},"delay":0,"changeRate":0.016066336076144792,"floatShares":450000,"shares":450000,"eps":0,"marketStatus":"盤後交易","change":0.7076,"latestTime":"09-15 16:30:47 EDT","open":44.95,"high":44.95,"low":44.72,"amount":632674,"amplitude":0.005222,"askPrice":45,"askSize":710,"bidPrice":43.78,"bidSize":4,"shortable":3,"etf":1,"ttmEps":0,"tradingStatus":3,"nextMarketStatus":{"tag":"收盤","tradingStatus":0,"beginTime":1789516800000},"marketStatusCode":4,"adr":0,"exchange":"NASDAQ","adjPreClose":44.0424,"nav":45.32679,"aum":20397057.56,"bidAskSpread":0,"preHourTrading":{"tag":"盘前","latestPrice":43.75,"preClose":44.0424,"latestTime":"08:42 EDT","volume":101,"amount":4419.9998749999995,"timestamp":1789476175770,"change":-0.2924,"changeRate":-0.006639,"amplitude":0.028382},"postHourTrading":{"tag":"盘后","latestPrice":44.75,"preClose":44.75,"latestTime":"16:10 EDT","volume":106,"amount":4743.5,"timestamp":1789503007565,"change":0,"changeRate":0,"amplitude":0},"volumeRatio":0.505514,"impliedVol":0.5734,"impliedVolPercentile":0.283},"@#url:\"https://hq.skytigris.cn/stock_info/fundamental/all\",params:#delay:false,,method:\"POST\",data:#items:@#symbol:\"SMHC\",,,,,undefined,":{"symbol":"SMHC","floatShares":450000,"roa":"--","roe":"--","lyrEps":0,"volumeRatio":0.505514,"shares":450000,"dividePrice":0,"high":44.95,"amplitude":0.005222,"preClose":44.0424,"low":44.72,"week52Low":42.7893,"pbRate":"--","week52High":68.69,"institutionHeld":0,"latestPrice":44.75,"committee":-0.988796,"eps":0,"divideRate":0,"volume":14119,"delay":0,"ttmEps":0,"open":44.95,"prevYearClose":60.475,"prevWeekClose":45.4401,"prevMonthClose":47.4332,"prevQuarterClose":67.75,"fiveDayClose":45.9509,"twentyDayClose":52.24},"@#url:\"https://hq.skytigris.cn/fundamental/corporate_actions/details/SMHC\",params:#limit:5,,,undefined,":[],"@#url:\"https://hq.skytigris.cn/fundamental/dividend/history\",params:#symbol:\"SMHC\",market:\"US\",,,undefined,":[],"@#url:\"https://hq.skytigris.cn/fundamental/estimate/recommendation\",params:#symbol:\"SMHC\",market:\"US\",delay:false,,,undefined,":{},"$inf$@#url:\"https://stock-news.skytigris.cn/v2/news/list\",params:#symbols:\"SMHC\",pageSize:20,pageCount:1,lang_content:\"cn\",edition:\"fundamental\",,,undefined,":[{"items":[{"id":"2667761820","title":"快訊：科創50指數升逾1% 半導體設備板塊震盪反彈","url":"https://stock-news.laohu8.com/highlight/detail?id=2667761820","media":"中金财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2667761820?lang=zh_tw&edition=fundamental","pubTime":"2026-09-15 11:05","pubTimestamp":1789441503,"startTime":"0","endTime":"0","summary":"　　9月15日消息，指数探底回升，深成指、创指翻红，科创50指数涨超1%。　　盘面上，半导体设备板块盘中震荡反弹，臻宝科技涨超10%；PCB概念反复活跃，华正新材7天3板，澳弘电子涨停；煤炭板块表现活跃，云煤能源触及涨停；MLCC概念震荡拉升，双星新材3连板。下跌方面，旅游板块震荡下挫，天目湖、桂林旅游跌停；农业板块再度调整，新农开发二连跌停；培育钻石板块回调，恒林股份领跌。","market":"hk","thumbnail":" http://caiji.3g.cnfol.com/colect/202609/15/20260915518802.jpg","type":0,"news_type":0,"thumbnails":[" http://caiji.3g.cnfol.com/colect/202609/15/20260915518802.jpg"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://sc.stock.cnfol.com/shichangceping/20260915/32369861.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"zhongjincaijing_highlight","symbols":["INT","WISE","SOXW","ASMU","SOXM","BCTK","TSMY","XITK","LOUP","THMZ","GINN","TSMZ","INVN","TEKY","159371","THNQ","TSMG","INYY","PSAI","IQM","GTEK","TWSC","LINT","SMHC","SHOC","YNOT","AIO","TSMX","CHPX","PSCT","AMA","LRCC","AIS","STSM","ASMG","APMI","LRCU","WDAI","PQNT","ASMZ","KSTR","LRNZ","QQJG","TSMU","ALAI","AMAU","XSEM","XT","INTW","FRWD"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2667690256","title":"多隻科創半導體ETF升逾3%","url":"https://stock-news.laohu8.com/highlight/detail?id=2667690256","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2667690256?lang=zh_tw&edition=fundamental","pubTime":"2026-09-15 10:22","pubTimestamp":1789438977,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["GTEK","APMI","AMAU","LRCU","AIS","LRCC","TWSC","INTW","TSMZ","LOUP","XITK","ALAI","LRNZ","SOXM","WDAI","INVN","KSTR","AIO","XSEM","AMA","THMZ","TSMU","FRWD","PSAI","SMHC","QQJG","CHPX","SOXW","ASMG","ASMU","PSCT","THNQ","TSMY","INT","INYY","XT","WISE","FDN","GINN","TSMX","BCTK","YNOT","STSM","IQM","TSMG","TEKY","SHOC","PQNT","ASMZ","LINT"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2667901786","title":"半導體設備板塊持續拉升，華海清科升逾10%","url":"https://stock-news.laohu8.com/highlight/detail?id=2667901786","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2667901786?lang=zh_tw&edition=fundamental","pubTime":"2026-09-15 10:18","pubTimestamp":1789438710,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["GINN","SMHC","ASMZ","SOXM","INTW","TSMY","FRWD","TEKY","INVN","AIS","TWSC","LOUP","AIO","KSTR","PSAI","LINT","ASMG","IQM","ASMU","LRNZ","PQNT","WISE","TSMG","SHOC","YNOT","BK4138","ALAI","INYY","AMAU","PSCT","APMI","QQJG","TSMZ","XITK","GTEK","CHPX","INT","WDAI","LRCC","TSMU","XSEM","LRCU","STSM","THMZ","THNQ","SOXW","XT","BCTK","AMA","TSMX"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2667903606","title":"半導體設備板塊震盪反彈 臻寶科技升逾10%","url":"https://stock-news.laohu8.com/highlight/detail?id=2667903606","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2667903606?lang=zh_tw&edition=fundamental","pubTime":"2026-09-15 10:00","pubTimestamp":1789437604,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["LRNZ","GTEK","ASMG","FRWD","KSTR","AMAU","TSMG","BCTK","AIO","PQNT","ALAI","TEKY","LRCU","XITK","TSMU","INTW","YNOT","TWSC","ASMU","IQM","AMA","STSM","APMI","INT","SMHC","INYY","LRCC","LOUP","THNQ","TSMY","TSMZ","TSMX","BK4138","PSAI","PSCT","SOXM","CHPX","INVN","XSEM","AIS","LINT","WDAI","ASMZ","SHOC","XT","SOXW","WISE","QQJG","THMZ","GINN"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2667697310","title":"兩部門：提升人工智能芯片設計水平","url":"https://stock-news.laohu8.com/highlight/detail?id=2667697310","media":"格隆汇","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2667697310?lang=zh_tw&edition=fundamental","pubTime":"2026-09-15 09:21","pubTimestamp":1789435260,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.gelonghui.com/rss/live/live.xml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_gelonghui","symbols":["ARMH","XIGV","INT","AMDG","SEMI","SMHC","XSEM","NVDW","NVDL","SOXM","SOXW","BAI","TSMG","AMDD","AMDY","QQQM","NVIT","SPTE","FTEC","TWSC","ARMG","NVDK","BCTK","AIYY","TSMY","DIPS","TSMX","CHPX","AVL","NVDG","NVDU","GFSG","SHOC","TSXU","TSXD","ONG","INYY","MUU","NVDX","ARMA","TCHI","TSMZ","AMUU","IXN","NVC","AMDC","IYW","KSTR","SEMY","AMDL"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2667638697","title":"兩部門：提升人工智能芯片設計水平","url":"https://stock-news.laohu8.com/highlight/detail?id=2667638697","media":"格隆汇APP","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2667638697?lang=zh_tw&edition=fundamental","pubTime":"2026-09-15 09:21","pubTimestamp":1789435260,"startTime":"0","endTime":"0","summary":"格隆汇9月15日｜工业和信息化部、国家发展改革委印发《电子信息制造业发展“十五五”规划》。其中提到，提升人工智能芯片设计水平，加强张量核心数据流组织、混合精度、动态稀疏计算、统一内存架构等技术攻关创新。聚焦低延迟、高吞吐、低功耗等核心性能指标，提高通用图形处理器(GPGPU)、专用集成电路(ASIC)、SoC等处理器综合计算能力，布局软硬耦合推理芯片等新路线。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/stock/bxjj/2026-09-15/doc-inirwfqe6997242.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["GFSG","NVC","QQQM","NVDG","SEMI","NVIT","AVL","ARMH","INT","AMDY","SEMY","SMHC","AMDC","SOXW","TSMG","TSMX","NVDW","TSMY","AIYY","NVDK","SOXM","TSMZ","SHOC","XSEM","AMDL","FTEC","IXN","IYW","ARMG","AMUU","INYY","KSTR","SPTE","AMDG","BAI","NVDU","BCTK","AMDD","MUU","DIPS","TSXD","TWSC","XIGV","TSXU","ONG","NVDX","CHPX","NVDL","ARMA","TCHI"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2667340697","title":"兩部門：提升人工智能芯片設計水平","url":"https://stock-news.laohu8.com/highlight/detail?id=2667340697","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2667340697?lang=zh_tw&edition=fundamental","pubTime":"2026-09-15 09:20","pubTimestamp":1789435249,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["AMDD","NVC","CHPX","TSMG","AVL","SPTE","BCTK","AMDY","SEMI","SOXW","NVDK","TCHI","AMDL","MUU","NVDU","AIYY","TSMX","GFSG","NVDL","TSMY","QQQM","TSXD","BAI","SEMY","NVDG","TWSC","SMHC","KSTR","DIPS","SHOC","AMUU","SOXM","AMDG","NVIT","ONG","INT","IXN","TSMZ","IYW","XSEM","INYY","AMDC","NVDX","TSXU","XIGV","ARMH","NYYY","ARMA","NVDY","NVDW"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2667563416","title":"韓媒：中國半導體由政府銀行企業以一團隊體制推進","url":"https://stock-news.laohu8.com/highlight/detail?id=2667563416","media":"链捕手","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2667563416?lang=zh_tw&edition=fundamental","pubTime":"2026-09-14 10:51","pubTimestamp":1789354283,"startTime":"0","endTime":"0","summary":" ChainCatcher 消息，据韩国《中央日报》报道，中国半导体产业由中央政府、地方政府、国有金融机构和企业分工协作，形成资金筹集、工厂建设与基础设施配套的一队体制。中国国家集成电路产业投资基金一期 1387 亿人民币、二期 2040 亿人民币、三期 3440 亿人民币，合计 6867 亿人民币，资金投入中芯国际、华虹半导体、长江存储等企业。长鑫存储成立 10 年全球 DRAM 份额升至第四，近三年净亏损 211.3 亿人民币，同期研发与设备投资 1852 亿人民币，合肥市国有资本在早期项目中提供约 80% 资金。韩国三星电子与 SK 海力士则承担投资、就业、技术开发及合作商支持等。韩国政府计划至 2047 年引导 622 万亿韩元民间投资，并提供 17 万亿韩元低息贷款和 1.1 万亿韩元半导体生态基金，但大部分由企业负担。韩国半导体产业协会常务副会长朴建洙：半导体是停止投资就会在下一轮上升期落后的产业，不景气时也需维持研发、设备投资及材料零部件设备订单，应有长期政策金融和税制支持。中国以国家层面支援体制追赶，韩国也需要政府、政界、金融机构和企业共同行动的应对体系。 ","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.chaincatcher.com/article/2289538","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["03191","KSTR","SMHC","161121"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2667631526","title":"一個織布廠長，押對中國半導體30年","url":"https://stock-news.laohu8.com/highlight/detail?id=2667631526","media":"蓝鲸财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2667631526?lang=zh_tw&edition=fundamental","pubTime":"2026-09-14 09:59","pubTimestamp":1789351157,"startTime":"0","endTime":"0","summary":"30年间，他没有造芯片，却几乎走过了中国半导体产业向上生长的完整路径。1988年12月30日，他从江阴第一织布厂来到如今中国芯片封装龙头长电科技的前身——江阴晶体管厂，担任党支部书记兼副厂长。对32岁的王新潮而言，最棘手的还不是这些数字，而是他对半导体几乎一无所知。这一次，王新潮押中的已经不是一款产品，而是一个产业趋势。2008年，全球金融危机再次袭来，长电科技订单受到冲击。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.lanjinger.com/d/1788839131618337872","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"lanjinger_stock","symbols":["03191","KSTR","SMHC"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2667639340","title":"ETF資金流|資金淨流出創新藥ETF、港股通創新藥ETF、化工ETF、半導體設備ETF等","url":"https://stock-news.laohu8.com/highlight/detail?id=2667639340","media":"格隆汇","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2667639340?lang=zh_tw&edition=fundamental","pubTime":"2026-09-14 09:11","pubTimestamp":1789348318,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.gelonghui.com/rss/live/live.xml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_gelonghui","symbols":["WDAI","SHOC","LRCC","YNOT","LINT","INTW","FDN","XT","SOXW","CHPX","STSM","ASMU","THNQ","159870","INT","XITK","APMI","BCTK","PSAI","ALAI","GTEK","159316","FLHK","SMHC","LOUP","QQJG","PSCT","ASMG","PQNT","AIO","ASMZ","TSMX","INVN","LRCU","WISE","THMZ","TSMG","SOXM","IQM","KSTR","TSMZ","TWSC","LRNZ","AMAU","GINN","TEKY","AIS","FRWD","AMA","XSEM"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2666569162","title":"興福電子：大基金二期減持計劃屆滿 減持1%股份","url":"https://stock-news.laohu8.com/highlight/detail?id=2666569162","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2666569162?lang=zh_tw&edition=fundamental","pubTime":"2026-09-10 17:04","pubTimestamp":1789031040,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["SMHC"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2666155687","title":"據兩名知情人士透露，美國司法部正在調查英偉達(NVDA.US)是否試圖規避反壟斷審查，以達成去年與人工智能芯片製造商Gr","url":"https://stock-news.laohu8.com/highlight/detail?id=2666155687","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2666155687?lang=zh_tw&edition=fundamental","pubTime":"2026-09-10 08:34","pubTimestamp":1789000489,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["WEBX","ARB","BWEB","GXPC","NVDW","ONG","NVDK","TDAQ","DIPS","SMHC","EVNT","ARMG","NVIT","AIYY","AMDY","FCOM","TSXU","NVDL","TGRW","BCTK","SPTE","SHOC","NVDY","IXN","NVDX","SEMY","NVDU","MSFX","AVL","GOOX","KSTR","JHCS","BUYO","NVC","TSMX","GFSG","SOXM","ARMH","JHMT","QQQM","AMDG","NBCC","WEBL","CHPX","HCA","FTEC","MSFY","DISC","NVDG","TSMG"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2666586096","title":"13個漲停！存儲擴產攪動半導體設備，有公司淨利增1324%","url":"https://stock-news.laohu8.com/highlight/detail?id=2666586096","media":"中金财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2666586096?lang=zh_tw&edition=fundamental","pubTime":"2026-09-09 16:55","pubTimestamp":1788944121,"startTime":"0","endTime":"0","summary":"2026年上半年，北方华创、中微公司、拓荆科技三大半导体行业龙头的营收、利润均实现不同程度增长，其中拓荆科技归母净利润同比增速高达1324%，领跑行业。　　全球存储产能持续扩张、半导体设备行业高景气度持续升温，叠加国产替代进程加速，A股半导体设备板块行情与基本面持续向好。在此行业背景下，传统家居企业爱丽家居跨界布局半导体设备赛道的并购动作，引发资本市场强烈追捧，自7月21日至9月1日，其累计斩获13个涨停。","market":"sh","thumbnail":" http://caiji.3g.cnfol.com/colect/202609/09/20260909458556.jpeg","type":0,"news_type":0,"thumbnails":[" http://caiji.3g.cnfol.com/colect/202609/09/20260909458556.jpeg"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://sc.stock.cnfol.com/shichangjuejin/20260909/32364855.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"zhongjincaijing_highlight","symbols":["LRCC","SOXW","GTEK","AMAU","PQNT","INYY","AIO","PSCT","AIS","LRNZ","QQJG","XT","CHPX","KSTR","ASMZ","SHOC","TEKY","FRWD","LRCU","TSMZ","ASMU","GINN","PSAI","AMA","STSM","IQM","THNQ","WDAI","TSMY","YNOT","XSEM","LOUP","LINT","BK4138","THMZ","TWSC","ASMG","INTW","SMHC","ALAI","TSMG","SOXM","WISE","INT","APMI","TSMU","BCTK","TSMX","XITK","INVN"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2666880605","title":"機構：2026年第二季晶圓代工營收接近534.9億美元 先進製程與AI需求持續強勁","url":"https://stock-news.laohu8.com/highlight/detail?id=2666880605","media":"格隆汇","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2666880605?lang=zh_tw&edition=fundamental","pubTime":"2026-09-09 15:31","pubTimestamp":1788939103,"startTime":"0","endTime":"0","summary":null,"market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.gelonghui.com/rss/live/live.xml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_gelonghui","symbols":["TSMX","XSEM","SEMY","LINT","SMHC","LRCC","TSEU","UMCX","EUVX","GFSG","UMCU","INT","NVDB","AMDL","ARTY","SOXM","NVDL","CHPX","INTW","VTHR","ASMG","TSMG","AMDW","TSMZ","ASMZ","NVII","AIPO","QTOC","AMDG","NVDS","DAMD","ARMH","SEMI","NVD","AMUU","TSEG","NVDW","NVDO","AMDC","AMAU","SHOC","TSMY","TSXU","CHAT","TWSC","KSTR","TSMU","TMYY","ASMU","AGIX"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2666588936","title":"機構：2Q26晶圓代工營收接近534.9億美元，先進製程與AI需求持續強勁","url":"https://stock-news.laohu8.com/highlight/detail?id=2666588936","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2666588936?lang=zh_tw&edition=fundamental","pubTime":"2026-09-09 15:24","pubTimestamp":1788938670,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["NVDL","ASMU","ARTY","INT","NVDO","KSTR","TSMG","VTHR","TSMZ","SEMY","AMAU","TSMU","NVYY","TSXU","LRCC","ASMZ","AMDG","ARMH","SHOC","QTOC","SMHC","SOXM","TSEU","TSMY","UMCX","AMYY","TMYY","STSM","XSEM","INYY","AMDL","ANV","GFSG","AMUU","TWSC","TSMX","DAMD","CHPX","CHAT","INTW","SEMI","AMDC","TSEG","APMI","AMDY","ASMG","AGIX","AIPO","EUVX","NVDQ"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2666588980","title":"機構：2Q26晶圓代工營收接近534.9億美元，先進製程與AI需求持續強勁","url":"https://stock-news.laohu8.com/highlight/detail?id=2666588980","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2666588980?lang=zh_tw&edition=fundamental","pubTime":"2026-09-09 15:24","pubTimestamp":1788938642,"startTime":"0","endTime":"0","summary":null,"market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["ARTY","CHAT","ARMH","ASMU","NVDY","CHPX","DIPS","SHOC","SOXM","NVDS","AMAU","VTHR","GFSG","XSEM","SEMY","AGIX","AMDL","AMUU","ASMG","TSMY","NVDL","AMDG","UMCX","TSMX","AIPO","KSTR","TSMZ","NVDO","QTOC","LRCC","TSMG","AMDC","SMHC","NVDU","TSMU","TSXU","EUVX","LRCU","INTW","TWSC","SEMI","NVDW","ASMZ","LINT","AMYY","INYY","TSEU","INT","TMYY","TSEG"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2666442305","title":"【券商聚焦】中信建投：看好半導體設備下半年創新高","url":"https://stock-news.laohu8.com/highlight/detail?id=2666442305","media":"金吾财讯","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2666442305?lang=zh_tw&edition=fundamental","pubTime":"2026-09-09 08:54","pubTimestamp":1788915298,"startTime":"0","endTime":"0","summary":"金吾财讯 | 中信建投证券研究指，（1）人形机器人：海内外催化不断，建议聚焦优质环节。（2）AIDC发电设备：全球燃机订单高景气延续，AIDC燃气发电项目建设同比高增。（3）工程机械：7月挖机内外销继续共振向上，板块将迎来逐季度改善。（4）半导体设备：存储IPO继续推动，看好半导体设备下半年创新高。（5）锂电设备：固态量产时间表收敛，装备环节兑现拐点确立。","market":"fut","thumbnail":"https://static.szfiu.com/news/20250109/YmQzNzBkZGZmOTg1MzM5MTQzMTA0Ng==.jpg","type":0,"news_type":0,"thumbnails":["https://static.szfiu.com/news/20250109/YmQzNzBkZGZmOTg1MzM5MTQzMTA0Ng==.jpg"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"1991082","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["PQNT","BCTK","WDAI","LOUP","09868","XT","AIS","ALAI","WISE","TWSC","601066","PSCT","02252","ASMG","AMAU","GTEK","ASMZ","HXXD.SI","09660","MIUmain","IQM","SOXM","KSTR","THNQ","YNOT","GINN","09880","SMHC","XITK","LRCC","02498","06682","KCE","01810","INT","81810","THMZ","AIO","02590","XSEM","CHPX","SOXW","SHOC","INVN","PSAI","FRWD","QQJG","LRNZ","TEKY"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2666231305","title":"業內人士：成熟製程芯片供需緊張或持續至 2028 年","url":"https://stock-news.laohu8.com/highlight/detail?id=2666231305","media":"链捕手","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2666231305?lang=zh_tw&edition=fundamental","pubTime":"2026-09-09 08:54","pubTimestamp":1788915288,"startTime":"0","endTime":"0","summary":" ChainCatcher 消息，据 DIGITIMES 报道，目前 IC 设计与半导体行业普遍认为，本轮成熟制程芯片供需紧张的持续时间会更长。多数行业观点判断，至少到 2028 年，行业都要积极争夺产能，涨价或将成为行业常态。甚至有观点认为，到 2030 年，成熟制程芯片供需关系都未必能够恢复平稳。IC 设计行业人士坦言，目前终端整体市场行情并不算火热，只是云端 AI 相关需求体量过于庞大，并且规模还在持续扩张。 ","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.chaincatcher.com/article/2288406","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["SMHC"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2666033813","title":"中信建投：存儲IPO繼續推動，看好半導體設備下半年創新高","url":"https://stock-news.laohu8.com/highlight/detail?id=2666033813","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2666033813?lang=zh_tw&edition=fundamental","pubTime":"2026-09-09 07:46","pubTimestamp":1788911164,"startTime":"0","endTime":"0","summary":null,"market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["TSMG","SOXW","REDS","FRWD","IPOS","BCTK","PQNT","SMHC","TEKY","SHOC","WISE","QQJG","ASMG","TWSC","XITK","IQM","LRCC","INVN","LOUP","TSMZ","GINN","TSMU","FRHC","KSTR","THMZ","ALAI","TSMX","XSEM","ASMU","SOXM","WDAI","YNOT","AMAU","KCE","LINT","APMI","CHPX","AIO","ASMZ","XT","STSM","THNQ","LRNZ","LRCU","GTEK","PSCT","TSMY","PSAI","AIS","INT"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2665546328","title":"英特爾晶圓代工與阿斯麥深化合作，推動High-NA EUV用於更大尺寸AI芯片","url":"https://stock-news.laohu8.com/highlight/detail?id=2665546328","media":"TradingKey中文","labels":["corporation"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2665546328?lang=zh_tw&edition=fundamental","pubTime":"2026-09-08 15:03","pubTimestamp":1788851034,"startTime":"0","endTime":"0","summary":"TradingKey - 英特尔（INTC）晶圆代工业务正与阿斯麦（ASML）进一步深化High-NA EUV合作。阿斯麦最新表示，将与包括英特尔、英伟达（NVDA）、台积电（TSM）和三星电子在内的主要芯片企业合作，开发更大尺寸光掩模，以推动下一代High-NA EUV设备用于大型AI和数据中心芯片制造。","market":"nz","thumbnail":"https://resource.tradingkey.com/cms_uploads/img/20240102/c0531811fe341e7a5268ef210c462723.jpg","type":0,"news_type":0,"thumbnails":["https://resource.tradingkey.com/cms_uploads/img/20240102/c0531811fe341e7a5268ef210c462723.jpg"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.tradingkey.com/zh-hans/analysis/stocks/us-stock/262155438-intel-foundry-asml-deepen-collaboration-promote-high-na-euv-larger-ai-chips-tradingkey","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["AIBU","03191","SMHC","SINTCmain","QQQA","AIQ","AVGC","AIFD","UMCX","XNTK","AMUU","TSMG","TTEQ","FAI","AIVC","TSMY","SHOC","TSEG","TSMX","BGIA","LINT","AMDC","ALAI","INTW","LEGR","AVGX","CNAV","INT","SEMY","SOXM","TSXU","AMDL","EUV","GPTZ","TSMU","AMDG","TMYY","TSEU","WISE","AIS","LRNZ","TWSC","FTXL","INTC","ARMH","CHPX","GFSG","TSMZ","EPAI","XSEM"],"isVideo":false,"video":null,"gpt_icon":0}],"pageSize":20,"totalPage":8,"pageCount":1,"totalSize":159,"code":"91000000","status":"200"}]}}